Description
Aluminum nitride is a kind of advanced thermal conductivity material, not only has the characteristics of ceramic insulation, low thermal expansion, but also has the thermal conductivity of metal copper aluminum, its thermal conductivity is 7~ 10 times of alumina, mechanical properties and alumina ceramics, but also has similar thermal expansion coefficient with silicon.
Aluminum nitride powder is mainly used to make power semiconductor chip support and heat dissipation substrate, and is widely used in communication base station, automobile, high-speed rail and power grid, consumer electronics, national defense and other fields.
Aluminum nitride has high purity, low oxygen content, high sintering activity and activitySharp size distribution
Aluminum nitride has high thermal conductivity and insulation, adding it to resins or plastics can significantly improve the resin or
Thermal conductivity of plastics.So it is widely used in thermal conductive filler
| Property | Unit | N-S- Ⅰ | N-S- Ⅱ | |
| Specific Surface Area | m2/g | 2.4~2.8 | 3.2~3.5 | |
| Mean Particle Size（D50） | μm | 1.1~1.4 | 0.8~1.0 | |
| Impurity | O | wt% | ＜0.8 | ＜0.8 |
| C | ppm | ＜300 | ＜300 | |
| Ca | ppm | 150~200 | ＜10 | |
| Si | ppm | ＜20 | ＜10 | |
| Fe | ppm | ＜8 | ＜8 | |
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